Micron Launches 12-Hi HBM3E Memory for Advanced AI GPUs
Monday, 9 September 2024, 11:19
Revolutionizing GPU Performance with HBM3E
Micron's newly announced 12-Hi HBM3E memory stacks are now production-ready, promising to empower the latest AI and HPC workloads. With a stunning capacity of 36 GB per stack and speeds that surpass 9.2 GT/s, these chips are engineered to meet the demands of cutting-edge processors like Nvidia’s H200.
Key Features of Micron's 12-Hi HBM3E Chips
- Up to 36 GB capacity per stack
- Speed capabilities over 9.2 GT/s
- Designed for AI and HPC applications
Implications for AI and HPC
The advancement of memory technology is crucial in enhancing the performance and efficiency of AI systems. Micron’s 12-Hi HBM3E chips are set to significantly push the boundaries of what's possible in the field.
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