China and ASML: The Challenges of Intel’s 18A and IBM's R&D Shifts

Friday, 6 September 2024, 04:25

China and ASML are facing critical challenges as Intel’s 18A process pushes forward and IBM announces closing its R&D units. The competition in semiconductor manufacturing intensifies with the US overtaking China's sales. This landscape creates a complex balance between innovation and geopolitical tensions.
Electronicsweekly
China and ASML: The Challenges of Intel’s 18A and IBM's R&D Shifts

China and ASML: A Tech Tug-of-War

As the global semiconductor scene heats up, China finds itself at a crossroads with ASML facing potential long-term exclusion from key supply chains. This scenario unfolds as Intel’s 18A process is set to revolutionize chip manufacturing, pushing innovation boundaries. IBM, notably, has decided to close its R&D units in China, raising questions about future advancements and collaborations.

The Rise of US Semiconductor Sales

With US semiconductor sales outpacing those of China, the industry landscape is evolving rapidly. The ongoing investment in semiconductor manufacturing within China continues to surge, challenging global leaders.

Future Implications

  • ASML faces potential technological isolation.
  • Intel's cutting-edge 18A process signifies a leap forward.
  • IBM's decision reflects shifting priorities in tech research.

This article was prepared using information from open sources in accordance with the principles of Ethical Policy. The editorial team is not responsible for absolute accuracy, as it relies on data from the sources referenced.


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