SK Hynix Innovation in Memory Chips with HBM3E Technology
Wednesday, 4 September 2024, 01:12
SK Hynix's Journey Towards Advanced Memory Technology
South Korean semiconductor supplier SK Hynix is set to change the landscape of memory innovation with the upcoming mass production of its state-of-the-art HBM3E 12-layer chips. This significant advancement comes straight from the insights shared by Justin Kim, head of AI Infra, during the recent Semicon Taiwan forum.
Key Insights from SK Hynix
- SK Hynix's new memory chips promise elevated speed and efficiency.
- The mass production is expected to begin by the end of this month.
- Plans to release HBM4 chips are underway for the second half of 2025.
Revolutionizing Industry Standards
As the second-largest memory chip maker globally, SK Hynix’s innovation signals a pivotal shift in technology and manufacturing standards within the semiconductor industry.
This article was prepared using information from open sources in accordance with the principles of Ethical Policy. The editorial team is not responsible for absolute accuracy, as it relies on data from the sources referenced.