This 1mm Fan on a Chip: A Breakthrough in Active Cooling Technology

Tuesday, 20 August 2024, 13:00

This 1mm fan on a chip introduces a revolutionary approach to active cooling in ultra-thin gadgets. By utilizing solid-state technology, the XMC-2400 microcooling chip from xMEMS could reshape how devices like smartphones and tablets manage heat. With its compact design, it promises enhanced performance and longevity for devices facing heat-related challenges.
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This 1mm Fan on a Chip: A Breakthrough in Active Cooling Technology

Revolutionizing Active Cooling with a 1mm Fan on a Chip

The emergence of the 1mm fan on a chip concept is set to redefine active cooling in ultra-thin gadgets. The xMEMS XMC-2400 microcooling chip employs advanced MEMS technology, paving the way for performance enhancement in compact devices.

Innovative Design and Performance

With a thickness of just one millimeter, this cutting-edge device features ultrasonic modulation for efficient air movement. It weighs less than 150 milligrams and delivers impressive cooling capability, moving up to 39 cubic centimeters of air per second while maintaining durability with an IP58 rating against dust and water damage.

Market Competition

  • Frore's AirJet Mini and Mini Slim are alternatives but are thicker at 2.8mm and 2.5mm.
  • Both solutions aim to address the overheating issues in modern electronics.

Future Implications

The practical applications of xMEMS' XMC-2400 chip could revolutionize the design of future devices, ensuring optimal performance without compromising on form factor.


This article was prepared using information from open sources in accordance with the principles of Ethical Policy. The editorial team is not responsible for absolute accuracy, as it relies on data from the sources referenced.


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