Samsung's 8-Layer HBM3E Chips Successfully Qualify for Nvidia's AI Processors

Tuesday, 6 August 2024, 23:03

Samsung's fifth-generation high bandwidth memory (HBM) chips, specifically the HBM3E version, have successfully passed testing by Nvidia for use in artificial intelligence processors. This milestone represents a significant advancement for Samsung, positioning it to compete more effectively against its rival SK Hynix. Although no supply agreement has been finalized yet, discussions are underway, with anticipated deliveries beginning in the fourth quarter of 2024.
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Samsung's 8-Layer HBM3E Chips Successfully Qualify for Nvidia's AI Processors

Samsung's HBM3E Chips Clear Nvidia's Tests

A version of Samsung Electronics' fifth-generation high bandwidth memory (HBM) chips, known as HBM3E, has successfully passed Nvidia's tests for use in its artificial intelligence (AI) processors, according to multiple sources familiar with the situation.

Development Milestone

This qualification marks an important milestone for Samsung, which has been striving to close the gap with its local competitor, SK Hynix, in the race to supply advanced memory chips capable of supporting generative AI applications.

Upcoming Supply Agreement

  • Samsung and Nvidia have not yet finalized a supply agreement.
  • Sources indicate that a deal is expected soon.
  • Anticipated supply of the approved eight-layer HBM3E chips is set to start by the fourth quarter of 2024.

In conclusion, Samsung's success in passing Nvidia's testing is a significant step forward for the company in the competitive high bandwidth memory market, especially in the context of AI technologies.


This article was prepared using information from open sources in accordance with the principles of Ethical Policy. The editorial team is not responsible for absolute accuracy, as it relies on data from the sources referenced.


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