Breakthrough Chip Wiring Innovations for More Energy-Efficient Computing
Monday, 8 July 2024, 11:30
Applied Materials Introduces Breakthrough Chip Wiring Innovations
Applied Materials has announced the latest Integrated Materials Solution, revolutionizing chip wiring by extending copper capabilities beyond 2nm.
New Endura Copper Barrier Seed IMS with Volta Ruthenium CVD
The innovative solution combines six unique technologies, setting a new industry standard for wiring efficiency.
- Industry-First Combination of Materials enables scaling copper wiring to 2nm and beyond
- Ruthenium and Cobalt Integration enhances chip performance and reduces power consumption
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