Taiwan Semiconductor Explores Introducing CoWoS Packaging Technology in Japan

Monday, 18 March 2024, 09:54
Taiwan Semiconductor is considering expanding its chip packaging capabilities by introducing its CoWoS technology to Japan, a move that could potentially enhance its global market presence. The advanced packaging technology has the potential to revolutionize the semiconductor industry by offering improved performance and efficiency. With a strategic focus on Japan, Taiwan Semiconductor aims to solidify its position as a key player in the global chip manufacturing landscape.
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Taiwan Semiconductor Explores Introducing CoWoS Packaging Technology in Japan

Taiwan Semiconductor Considers Chip Packaging Expansion

One option being evaluated by the company is to bring its chip on wafer on substrate, or CoWoS, packaging technology to Japan, the report added.

This article was prepared using information from open sources in accordance with the principles of Ethical Policy. The editorial team is not responsible for absolute accuracy, as it relies on data from the sources referenced.

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