Taiwan Semiconductor Manufacturing Company (TSMC) Considering Expansion of Chip Packaging Capability in Japan
Monday, 18 March 2024, 06:12
Exclusive: TSMC considering advanced chip packaging capacity in Japan, sources say
Taiwan Semiconductor Manufacturing Company (TSMC) is reportedly exploring the possibility of expanding its chip packaging operations in Japan, as per reliable sources familiar with the matter.
Key Points:
- TSMC considering increasing advanced chip packaging capacity in Japan
- This strategic move demonstrates the company's commitment to global expansion and meeting market demands
- The expansion could have significant implications for both TSMC's market presence and the semiconductor industry
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