AST SpaceMobile Commences Tape-Out Phase for ASIC Chip in Collaboration with TSMC

Thursday, 28 March 2024, 08:32

AST SpaceMobile (ASTS) has officially started the tape-out phase for its Application-Specific Integrated Circuit (ASIC) with leading semiconductor manufacturer TSMC. This significant step marks a pivotal moment in their partnership to revolutionize space communications technology. The collaboration between AST SpaceMobile and TSMC highlights a strategic move towards innovative satellite communication solutions, positioning them as key players in the evolving space industry.
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AST SpaceMobile Commences Tape-Out Phase for ASIC Chip in Collaboration with TSMC

AST SpaceMobile Tape-Out Phase Commencement

AST SpaceMobile (ASTS) has recently initiated the tape-out phase for its Application-Specific Integrated Circuit (ASIC) in partnership with TSMC. This marks a crucial milestone in the development of advanced space communication technology.

Collaboration with TSMC

The partnership between AST SpaceMobile and TSMC underscores a strategic alliance aimed at enhancing satellite communication capabilities. By leveraging TSMC's expertise in semiconductor manufacturing, AST SpaceMobile aims to revolutionize the space communication industry.


This article was prepared using information from open sources in accordance with the principles of Ethical Policy. The editorial team is not responsible for absolute accuracy, as it relies on data from the sources referenced.


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