Global EUV Installation Trends: TSMC, ASML, and the Future of Lithography Technology

Wednesday, 13 November 2024, 11:17

Lithography innovation drives the semiconductor industry, with global EUV installation rates soaring. Taiwan Semiconductor Manufacturing Company (TSMC) has significantly increased its share of EUV systems, reaching 56% by 2023, while ASML continues to lead in advanced lithography tools. This article examines the current landscape and future prospects of high-NA EUV lithography in semiconductor manufacturing.

Scmp — Global EUV Installation Trends: TSMC, ASML, and the Future of Lithography Technology

Lithography Innovation and Global EUV Installation

As the lithography sector evolves, understanding global EUV installation rates becomes crucial. The technology symposium hosted by TSMC showcased its increased adoption of high-NA EUV lithography tools, setting a benchmark in semiconductor manufacturing efficiency.

TSMC's Dominance in EUV Systems

TSMC's share of global EUV installations surged from 50% to 56% from 2020 to 2023.
Reports estimate TSMC acquired 84 EUV systems in 2022 and over 100 in 2023.
The company utilized EUV lithography for its groundbreaking N7+ process in 2019, paving the way for N5 and N3.

Future Prospects for High-NA EUV Technology

During the 2024 Technology Symposium, TSMC reiterated that the careful evaluation of new tools and advanced transistor structures will dictate its further integration of high-NA EUV systems into mass production.

Samsung Foundry's EUV Endeavors

Samsung Foundry, a key player, also leans toward adopting EUV technology for its 7LPP, 5nm, and 3nm GAA processes, enhancing their semiconductor manufacturing capabilities.

This article was prepared using information from open sources in accordance with the principles of Ethical Policy. The editorial team is not responsible for absolute accuracy, as it relies on data from the sources referenced.