AI Drives Demand for SK Hynix’s HBM4 Memory Chips Amid Global Semiconductor Shortage
AI and the Semiconductor Shortage
Nvidia's CEO, Jensen Huang, has urged SK Hynix to expedite the delivery of HBM4 memory chips amid a significant global shortage of semiconductors. This request emphasizes the crucial demand for advanced chips to support AI development.
SK Hynix's Response to Market Needs
SK Group leader, Chey Tae-won, indicated that they are committed to enhancing production capabilities. The company plans to deliver its innovative 12-layer HBM4 chips by 2025, but the growing appetite for memory chips in the AI sector necessitates quicker progress.
Innovations in Memory Technology
- HBM3E chips samples are expected to ship by early 2025, showcasing SK Hynix's leadership in memory chip technology.
- Kwak Noh-jung, CEO of SK Hynix, highlighted ongoing development of 16-layer HBM3E chips to enhance performance.
- The advancements in bandwidth, power efficiency, and overall capacity are pivotal for AI applications.
Samsung is facing challenges in keeping pace with SK Hynix in the HBM market, leading to increased competition.
This article was prepared using information from open sources in accordance with the principles of Ethical Policy. The editorial team is not responsible for absolute accuracy, as it relies on data from the sources referenced.