Intel Improves Semiconductor Packaging and Testing with US$300 Million Investment in Chengdu
Strengthening Semiconductor Manufacturing in Chengdu
Intel has announced a significant investment of US$300 million to enhance its semiconductor packaging and testing facility in Chengdu, Sichuan. This expansion aims to improve the efficiency of local supply chains and increase support for Chinese customers amidst growing tensions with Washington.
Addressing Cybersecurity Concerns
In light of recent calls from the Cyber Security Association of China for a review of Intel products due to identified vulnerabilities, this investment signifies the company's commitment to product safety. The Chengdu plant has been pivotal in packaging and testing over half of Intel's laptop processors worldwide.
Key Benefits of the Investment
- Enhances capacity for server chips and integrated circuits.
- Establishes a customer solutions centre to streamline operations.
- Maintains strong revenue stream from the Chinese market.
This article was prepared using information from open sources in accordance with the principles of Ethical Policy. The editorial team is not responsible for absolute accuracy, as it relies on data from the sources referenced.