Hong Kong Targets HK$30 Billion Funding for San Tin Technopole Amid Legal Challenges
Northern Metropolis Funding for San Tin Technopole
Hong Kong authorities will seek about HK$30 billion (US$3.86 billion) for the first-stage development of a technology hub near the border with mainland China despite an ongoing legal challenge to the project. Secretary for Development Bernadette Linn Hon-ho also revealed that the government seeks to open bidding next year for the first of three land parcels to be developed under a pilot model within the Northern Metropolis, a massive development housing the San Tin Technopole.
- Authorities will request funding for site formation and infrastructure works for San Tin Technopole.
- The first round will cover about 158 hectares, including zones for innovation and technology.
- Approximately 5,500 to 6,000 public housing flats are expected to be provided.
- Residents may begin moving in from 2031.
San Tin Technopole Overview
The project will occupy more than 600 hectares of land earmarked for the Northern Metropolis, planned to include new business and residential areas. In September, the Development Bureau confirmed plans following zoning changes to address public concerns, and despite challenges regarding environmental impact, the project moves forward.
- Chief Executive John Lee Ka-chiu emphasized accelerating the overall development of Northern Metropolis.
- Funding will target delivering new innovation areas starting from the 2026-27 financial year.
- Land supply projections indicate approximately 1,700 hectares will be available, increasing the area's total supply.
For the Northern Metropolis, about 3,000 hectares of land is projected to be made available for development over the next decade. This aligns with the "Hong Kong 2030+" planning strategy's objectives.
This article was prepared using information from open sources in accordance with the principles of Ethical Policy. The editorial team is not responsible for absolute accuracy, as it relies on data from the sources referenced.