Taiwan Semiconductor Manufacturing Reports Strong Demand for AI Accelerators and Advanced Packaging Progress in Q1 2024 Earnings Call

Thursday, 18 April 2024, 12:30

Taiwan Semiconductor Manufacturing (TSM) saw a slight revenue upside in the first half of 2024 but maintains full-year guidance of low to mid-20% growth. Demand for 3-nanometer technology is expected to triple from 2023. TSMC is working on 3DIC and SoIC adoption, expecting customers to adopt these advanced packaging solutions soon.

https://store.livarava.com/3af18789-fd80-11ee-a6bf-63e1980711b2.jpg — Taiwan Semiconductor Manufacturing Reports Strong Demand for AI Accelerators and Advanced Packaging Progress in Q1 2024 Earnings Call

Revenue Guidance

TSMC's revenue outlook for the first half of 2024 has seen a slight upside, with full-year guidance remaining the same.

Technology Conversion

TSMC is focused on converting capacity to meet the strong demand for advanced technologies like 3-nanometer, emphasizing demand for AI accelerators.

Advanced Packaging Progress

TSMC is actively working on 3DIC and SoIC adoption, expecting customers to adopt these advanced packaging solutions in the near future.

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